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Same model may have multiple batches, images only for reference.
APA300-FGG256I Real Image
Same model may have multiple batches, images only for reference.

APA300-FGG256I

Part No APA300-FGG256I
Manufacturer Microsemi Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 186 I/O 256FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Microsemi Corporation
Packaging Tray
Total RAM Bits 73728
Number of I/O 186
Number of Gates 300000
Supply Voltage (V) 2.3V ~ 2.7V
Mounting Style SMD
Temperature Range - Operating -40°C ~ 85°C
Manufacturer Package 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Part Number Series APA300
Manufacturer Pack Quantity 90
MSL Level 3 (168 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 813611-APA300-FGG256I
Ultra Librarian 3D Model Ultra Librarian APA300-FGG256I CAD Model

Description

The Microsemi Corporation APA300-FGG256I is an electronic component with a manufacturer pack quantity of 90. It is packaged in a tray and mounted in SMD style.

  • I/Os: 186
  • Total RAM Bits: 73728
  • Gates: 300000
  • Supplier Device Package: 256-FPBGA (17x17)
  • Manufacturer Package: 256-LBGA
  • Supply and Demand Status: Limited
  • MSL Level: 3 (168 Hours)
  • Supply Voltage: 2.3V to 2.7V
  • Part Number Series: APA300

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