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MT29F512G08EBLLHB57T3WC1-QPES

Part No MT29F512G08EBLLHB57T3WC1-QPES
Manufacturer Micron Technology Inc.
Catalog IT infrastructure Memory
Description TLC 512G Die 64GX8
Sample
Rohs State Need to verify
ECAD Module
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Category IT infrastructure Memory
Win Source Part Number 1454769-MT29F512G08EBLLHB57T3WC1-QPES
Manufacturer Micron Technology Inc.
Ultra Librarian 3D Model Ultra Librarian MT29F512G08EBLLHB57T3WC1-QPES CAD Model

Description

The MT29F512G08EBLLHB57T3WC1-QPES by Micron Technology is a cutting-edge Flash Memory component, part of the NAND/NOR category, emphasizing high-density storage solutions. This specific model utilizes Triple-Level Cell (TLC) technology, allowing three bits of data to be stored in each cell. With a generous 512G die size and a configuration of 64Gx8, it offers substantial storage capabilities suitable for a wide array of applications, from solid-state drives (SSDs) to other forms of high-capacity memory needs. Micron, a leading manufacturer in the memory sector, ensures that this chip not only provides voluminous storage but does so with the reliability and performance expected from their products. It's designed for applications that demand significant data storage within a compact physical footprint, blending seamlessly into modern technology systems requiring efficient and reliable memory solutions.

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