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H5PS2G83AFR-S6C-C

Part No H5PS2G83AFR-S6C-C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR2-800 256Mx8 (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942426-H5PS2G83AFR-S6C-C
Series *
Ultra Librarian 3D Model Ultra Librarian H5PS2G83AFR-S6C-C CAD Model

Description

The Hynix H5PS2G83AFR-S6C-C is a 2Gb (Gigabit) DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. This memory component is designed for applications requiring a balance of high-speed data access and efficient memory management. The 'S6C-C' likely denotes a specific speed grade, temperature range or other operational characteristics within the DDR specification.

Applications:

  • Graphics cards for mid-range systems
  • Gaming consoles
  • Networking devices such as routers and switches
  • Set-top boxes and media players
  • Embedded systems needing substantial memory capacity

Features:

  • Capacity: 2Gb (Gigabit)
  • Organization: Likely organized as 256M x 8
  • Interface: DDR
  • Data Rate: High-speed data transfer (specific rate determined by 'S6C' speed grade)
  • Voltage: Typically operates at 1.8V
  • Package: FBGA (Fine-Pitch Ball Grid Array) for compact size and efficient PCB mounting
  • Clock Frequency: Optimized for DDR operation and the specific speed grade

Benefits:

  • High Bandwidth: Enables fast data transfer rates, improving system performance
  • Low Power: Reduces energy consumption, suitable for portable and energy-sensitive devices
  • Compact Size: FBGA packaging saves valuable board space
  • Improved System Responsiveness: Faster memory access reduces latency and improves overall system responsiveness
  • Reliable Operation: Designed for robust and reliable performance in various operating conditions

Additional Details:

The H5PS2G83AFR-S6C-C conforms to JEDEC standards for DDR SDRAM. The 'S6C-C' marking indicates the specific speed bin and timing characteristics of the device. DDR memory doubles the data transfer rate by transferring data on both the rising and falling edges of the clock signal. The FBGA package provides excellent thermal performance and simplifies PCB assembly. Refer to the official Hynix datasheet for detailed timing parameters, voltage specifications, and other technical information.

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Pricing & Ordering

Quantity Unit Price Ext. Price
2+ $47.6345 $95.2690
3+ $39.0840 $117.2520
5+ $37.8632 $189.3160
7+ $36.6412 $256.4884
9+ $35.4204 $318.7836
11+ $31.7567 $349.3237
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Availability: 3,462 pieces
MOQ: 2 pcs
Order Increment : 1 pcs
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