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XCKU15P-1FFVE1517I

Part No XCKU15P-1FFVE1517I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 512 I/O 1517FCBGA / series Field Programmable Gate Array (FPGA) IC 512 82329600 1143450 1517-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Kintex® UltraScale+™
Package Tray
Number of LABs/CLBs 65340
Number of Logic Elements/Cells 1143450
Total RAM Bits 82329600
Number of I/O 512
Voltage - Supply 0.825V ~ 0.876V
Mounting SMD (SMT)
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Base Product Number XCKU15
MSL Level 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1199684-XCKU15P-1FFVE1517I
Ultra Librarian 3D Model Ultra Librarian XCKU15P-1FFVE1517I CAD Model

Description

The XCKU15P-1FFVE1517I is a Kintex UltraScale+ FPGA from AMD (formerly Xilinx). It is a high-performance programmable logic device designed for demanding applications requiring high bandwidth, low latency, and power efficiency.

Applications:

  • Data center acceleration
  • Network processing
  • High-performance computing
  • Test and measurement equipment
  • Aerospace and defense applications

Features:

  • Logic Cells: Approximately 1.1 million
  • System Logic Cells: >1.7 million
  • Memory: Over 75 Mb of Block RAM
  • DSP Slices: 5520
  • Transceivers: 32 x 32.75 Gbps transceivers
  • I/O: Up to 1100 user I/Os
  • Package: FFVE1517 (Flip-Chip Fine-Pitch Ball Grid Array)
  • Operating Temperature: Industrial (-40°C to +100°C junction)
  • Voltage: Core voltage 0.85V

Benefits:

  • Extremely high logic density enables complex and sophisticated designs.
  • High-speed transceivers provide exceptional bandwidth for data-intensive applications.
  • Large Block RAM capacity allows for on-chip data storage and processing.
  • DSP slices accelerate digital signal processing algorithms.
  • Abundant user I/Os support a wide range of interface standards.
  • The FFVE1517 package provides high pin density for maximum connectivity.
  • Industrial temperature range ensures reliable operation in harsh environments.
  • Low core voltage minimizes power consumption.

The Kintex UltraScale+ family provides leading-edge performance and power efficiency. This device is well-suited for applications requiring significant computational resources and high-speed data transfer. The combination of high logic density, advanced transceivers, and extensive memory resources makes this FPGA a powerful solution for demanding applications.

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