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MT29F256G08CKCDBJ5-6R

Part No MT29F256G08CKCDBJ5-6R
Manufacturer Micron Technology Inc.
Catalog Hard To Find
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Reference Date Code 14+
Reference case TBGA
Manufacturer Micron Technology Inc.
Manufacturer Homepage www.micron.com
Win Source Part Number 715505-MT29F256G08CKCDBJ5-6R
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian MT29F256G08CKCDBJ5-6R CAD Model

Description

The MT29F256G08CKCDBJ5-6R is a 256Gb NAND Flash memory device manufactured by Micron Technology. It's based on a multi-level cell (MLC) architecture, providing high storage density and cost-effectiveness. This device is designed for use in a wide range of solid-state storage applications.

Applications:

  • Solid-State Drives (SSDs)
  • Embedded Systems
  • Mobile Devices (Smartphones, Tablets)
  • Data Centers
  • Memory Cards (SD, microSD)

Features:

  • Capacity: 256Gb (32GB)
  • NAND Flash Technology: MLC (Multi-Level Cell)
  • Interface: ONFI 3.0
  • Operating Voltage: 3.3V
  • Page Size: 16KB + 1440B spare
  • Block Size: 1152 pages
  • Data Transfer Rate: Up to 400 MT/s

Benefits:

  • High Storage Capacity: The 256Gb density allows for storing large amounts of data in a single device.
  • Cost-Effective Storage: MLC technology provides a lower cost per bit compared to SLC (Single-Level Cell) NAND flash.
  • Fast Data Transfer: High data transfer rates improve system performance.
  • Standard Interface: The ONFI 3.0 interface simplifies integration with various host controllers.
  • Low Power Consumption: Optimized power management features extend battery life in portable devices.

Additional Details:

The MT29F256G08CKCDBJ5-6R utilizes a 128-bit data bus for efficient data transfer. It incorporates advanced error correction code (ECC) to ensure data integrity. The device is available in a standard BGA (Ball Grid Array) package for surface-mount assembly. It's designed for operation in a wide temperature range, making it suitable for various environmental conditions.

This NAND Flash memory is used in applications where high capacity, fast data access, and low power consumption are critical requirements. Always refer to the manufacturer's datasheet for detailed specifications and application guidelines.

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